"Resin potting" for waterproofing, dustproofing, and pest control of circuit boards.
Injecting urethane resin into the substrate case. It protects the substrate from water, dust, vibration, and insects. Recommended for substrates used in harsh environments such as high temperature, high humidity, and outdoors.
By injecting urethane resin into the substrate case, it shuts out dust, dirt, and water. It also secures the substrate, protecting it from vibrations. This achieves moisture resistance, waterproofing, dustproofing, and a longer lifespan for the substrate. *Multiple case sizes are available to fit the substrate size: - 75 x 75 (mm) - 120 x 95 (mm) - 140 x 117 (mm) - 160 x 120 (mm) - 203 x 140 (mm)
- Company:タイム技研
- Price:Other